Advanced Dicing Technologies
Dicing Saws/ Blades & laser Scribing Systems + Peripherals.
Vacuum, Lamination, Separation, Control & Information Processing, Transfer & Drive, Cutting, Cleanliness, Taping & De-taping Equipment for Grinding & Dicing Processes.
High precision testing machines for wire bond pull, ball bond shear, die shear, ball pull, and stud pull. Pick and place machines for silicon.
World Leader in the development and manufacturers of MIXERS
North Star Imaging
NSI provides World Class Industrial Digital X-ray and 3D Computed Tomography Systems.
High-Precision Mechanical Contact Profilers and Optical Profiler.
Leading supplier of NIST traceable calibration standards and calibration certificates.
Provides a complete line of die-singulation products for dry-icing, saw dicing, wafer bonding, and wafer expanding processes.
IKK offers systems, services and training in the field of non-destructive testing technology (NDT). In particular, Insight specialised in non-destructive testing by using Ultrasound technology.
Provide a wide range of wafer dicing applications through a commitment to quality and superior service.